MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

ObrázekObjednací číslo výrobcePopisMetoda připevněníTvarAvailable QuantityCenaZobrazit podrobnosti
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMTermopáska, Včetně lepidlaČtyřhran, Úhlová žebra100 - Immediate$240.59Zobrazit podrobnosti
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMSvorka, Tepelný materiálČtyřhran, Úhlová žebra0 - Immediate$260.34Zobrazit podrobnosti
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMTermopáska, Včetně lepidlaČtyřhran, Úhlová žebra187 - Immediate$213.72Zobrazit podrobnosti
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMSvorka, Tepelný materiálČtyřhran, Žebra615 - Immediate$260.17Zobrazit podrobnosti
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMSvorka, Tepelný materiálČtyřhran, Úhlová žebra975 - Immediate$318.70Zobrazit podrobnosti
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMSvorka, Tepelný materiálČtyřhran, Úhlová žebra65 - Immediate$314.74Zobrazit podrobnosti
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMSvorka, Tepelný materiálČtyřhran, Úhlová žebra32 - Immediate$309.74Zobrazit podrobnosti
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMSvorka, Tepelný materiálČtyřhran, Úhlová žebra100 - Immediate$311.83Zobrazit podrobnosti
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMTermopáska, Včetně lepidlaČtyřhran, Úhlová žebra1918 - Immediate$162.47Zobrazit podrobnosti
PTM Published on: 2011-10-13

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Related Product Highlight

Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.