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Produkt služby Marketplace
Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects
CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.
Part List
| Obrázek | Objednací číslo výrobce | Popis | Available Quantity | Cena | Zobrazit podrobnosti | |
|---|---|---|---|---|---|---|
 |  | 3800520001 | CONN SPRING MOD 25POS SMD | 35 - Immediate | $2,062.00 | Zobrazit podrobnosti |
|  | 3800520013 | CONN SPRING MOD 51POS SMD | 0 - Immediate | $1,816.10 | Zobrazit podrobnosti |
|  | 4631533093 | CABLE FFC/FPC 25POS 0.64MM 3" | 3 - Immediate | $1,753.33 | Zobrazit podrobnosti |
