AMPMODU 1 mm Centerline Interconnection System

TE Connectivity’s (TE) AMPMODU small centerline interconnection systems are fine-pitch 1 mm (0.0394") connectors that offer 85% space savings on the board when compared to standard 2.54 mm pitch products. Building on the industry-known AMPMODU platform, the 1 mm centerline offers design engineers a space-saving option to the traditional and well-trusted legacy AMPMODU portfolio. The dual-beam contact design provides a reliable electrical connection even in severe shock and vibration environments. To serve a broad range of design requirements, the portfolio offers up to 100 positions with two plating options and supports automated surface-mounting and reflow processes.

Benefits

• Manufacturing flexibility in automated environments with a surface-mount configuration and pick-and-place cap
• Improved durability and corrosion resistance with gold plating
• Time savings thanks to reflow-capable materials
• Greater flexibility in the assembly of boards with dual-entry receptacles