Sentrality High-Current Interconnect System

Molex's Sentrality high-current interconnect system delivers up to 350.0 A of current through four diameter sizes (3.40 mm, 6.00 mm, 8.00 mm, and 11.00 mm) and offers a wide range of configurations, connecting PCBs and busbars. It is difficult to have perfect pin-to-socket alignment when mating two rigid PCBs or busbars. A degree of float is needed in these situations to accommodate any misalignment there may be. The Sentrality high-current interconnect system provides up to 1.0 mm of radial float in all four sizes. This diversity serves to assure ease of mating and also prevents potential damage to the socket contact beams.

Dense electronic packaging demands ever-lower profiles, minimal protrusions above mated PCBs or busbars, or both. The Sentrality high-current interconnect system offers a mated profile as low as approximately 2.00 mm in all four sizes. It can do so without the compromise of requiring large protrusions above or below the mated boards.

Power efficiency is critical to cost management in large power-consuming operations, such as datacenters, 5G radios, and EV power trains. The Sentrality high-current interconnect system is designed with multiple contact beams per socket. This design serves to assure a solid electrical performance (low voltage drop).

Features

• Capable of 30.0 A to 350.0 A current rating
• Offers a scalable design to meet a wide range of high-current applications
• Multiple contact beams on socket
• Provides optimized electrical performance
• Wave springs provide a float mechanism, so the entire core socket assembly moves within the housing
• No added stress on contacts
• Low mating forces
• No risk of contact resistance increase due to high contact beam deflection
• Pin termination methods include knurled press-fit for busbars, surface-mount for PCBs, and screw-mount for either busbars or PCBs
• Provides design flexibility for a range of high-current applications
• Socket termination methods include knurled press-fit for busbars, surface-mount for PCBs, eye-of-needle press-fit for PCBs, and screw-mount for either busbars or PCBs
• Provides design flexibility for a range of high-current applications
• Utilizes the COEUR contact design in all Sentrality socket assemblies scaled for different sizes (3.4 mm, 6.0 mm, 8.0 mm, and 11.0 mm)
• Delivers the same 10.0 mm socket assembly profile height regardless of size

Resources

• Common Challenges of High Power Pin-to-Socket
• Three Things to Know About Next-Generation Tracking: First, Are Your Robots Performing at Peak?
• Grounding Jumpers Protect Workers from Electrocution and Equipment from Damage