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Tflex SF10 Thermal Gap Filler
Laird's high-performing non-silicone gap filler is extremely soft and exhibits very low pressure on components
Laird's Tflex SF10 thermal gap filler is a high-performing, non-silicone product that is also extremely soft and exhibits very low pressure on components. Tflex SF10 is an innovative high-performing thermal material in Laird’s gap filler portfolio. The silicone-free material measures 10 W/mk and has excellent deflection properties which provide minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.
Features
- High thermal conductivity
- Low shore harndness value
- Deflects easily with minimal pressure
- Silicone-free formulation
- Low peak and residual pressure
- Naturally tacky
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- UL94 V0
- RoHS and REACH compliant
Applications
- Automotive ADAS
- Automotive electronics
- Automotive infotainment
- Gaming systems
- Tablets/notebooks
- Routers
- Servers
- Smart home devices
- Wireless infrastructure
Tflex SF10 Thermal Gap Filler
| Obrázek | Objednací číslo výrobce | Popis | Available Quantity | Cena | Zobrazit podrobnosti |
|---|---|---|---|---|---|
 | A18213-02 | THERM PAD 229MMX229MM GRAY | 230 - Immediate | $1,091.65 | Zobrazit podrobnosti |
| A18213-06 | THERM PAD 229MMX229MM GRAY | 973 - Immediate | $3,029.52 | Zobrazit podrobnosti |
| A18213-04 | THERM PAD 229MMX229MM GRAY | 296 - Immediate | $2,262.24 | Zobrazit podrobnosti |
| A18213-10 | THERM PAD 229MMX229MM GRAY | 54 - Immediate | $5,923.47 | Zobrazit podrobnosti |
| A18213-08 | THERM PAD 229MMX229MM GRAY | 274 - Immediate | $3,789.00 | Zobrazit podrobnosti |
Published: 2021-06-08
Česká republika