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XCede® HD High-Density Backplane System
Samtec's XCede HD small form factor high-density backplane system is ideal for density-critical applications
Samtec's XCede HD consists of signal, power, and keying/guidance modules for incredible design flexibility, combining a small form factor for significant board and system space savings. The system's modularity allows designers to create a fully custom backplane solution with optional power modules, guidance and keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.
Resources
Features
- Up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-pair, 4-pair, and 6-pair designs
- 4, 6, or 8 columns
- 12 to 48 pairs
- Up to a 3.00 mm contact wipe on signal pins
- Multiple signal/ground pin staging options
- Integrated power, guidance and keying, and side wall options available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
Applications
- Datacom
- Computer/semiconductor
- Instrumentation
- Aerospace/defense
- Industrial
- Medical
- Consumer
- Auto/trans/telematics
Published: 2022-06-10
Czech Republic