Name: 374324B00035G
Brand: Boyd Laconia, LLC
SKU: HS318-ND
Price: 66.2233 CZK
Availability: InStock

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

374324B00035G
DigiKey Part Number	HS318-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	374324B00035G
Description	HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time	14 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet	Datasheet

Product Attributes

Type	Description	Select All
Category	Fans, Blowers, Thermal Management Thermal Heat Sinks
Mfr	Boyd Laconia, LLC
Series	37432
Packaging	Box
Part Status	Active
Type	Board Level
Package Cooled	BGA, FPGA
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Pin Fins
Length	1.063" (27.00mm)
Width	1.063" (27.00mm)
Diameter	-
Fin Height	0.394" (10.00mm)
Power Dissipation @ Temperature Rise	3.0W @ 90°C
Thermal Resistance @ Forced Air Flow	9.30°C/W @ 200 LFM
Thermal Resistance @ Natural	30.60°C/W
Material	Aluminum
Material Finish	Black Anodized
Shelf Life	-
Base Product Number	374324

Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 1 834

Check for Additional Incoming Stock

Non-Cancelable/Non-Returnable

Quantity

All prices are in CZK

Box