Name: 374324B60023G
Brand: Boyd Laconia, LLC
SKU: HS522-ND
Price: 91.4881 CZK
Availability: InStock

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374324B60023G
DigiKey Part Number	HS522-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	374324B60023G
Description	BGA HEAT SINK
Manufacturer Standard Lead Time	13 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet	Datasheet

Product Attributes

Type	Description	Select All
Category	Fans, Blowers, Thermal Management Thermal Heat Sinks
Mfr	Boyd Laconia, LLC
Series	37432
Packaging	Bulk
Part Status	Active
Type	Board Level
Package Cooled	BGA, FPGA
Attachment Method	Solder Anchor
Shape	Square, Pin Fins
Length	1.063" (27.00mm)
Width	1.063" (27.00mm)
Diameter	-
Fin Height	0.394" (10.00mm)
Power Dissipation @ Temperature Rise	1.5W @ 50°C
Thermal Resistance @ Forced Air Flow	6.00°C/W @ 500 LFM
Thermal Resistance @ Natural	30.60°C/W
Material	Aluminum
Material Finish	Black Anodized
Base Product Number	374324

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