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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD41 - Immediate$2,062.00View Details
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - Immediate$1,816.10View Details
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"6 - Immediate$1,788.40View Details
CABLE FFC/FPC 51POS 0.64MM 3"4631533094CABLE FFC/FPC 51POS 0.64MM 3"0 - ImmediateSee Page for PricingView Details

Related Product Highlight

CIN::APSE Stacking Connector Jumpers Cinch Connectivity’s CIN:APSE stacking connectors are designed for coplanar and angled board-to-board applications.

Related Articles and Blogs

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