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SON is the latest horizontal PhotoMOS package to deliver on the need for feature expansion and board space reduction. Volume and footprint are approximately half the SSOP package size. Additionally SON PhotoMOS incorporate a no lead design that allows closer board mounting of each component. Improved high frequency characteristics are an added benefit as a result of reduced wiring area leads.

PTM Published on: 2011-12-15
PTM Updated on: 2017-03-10