Phase Change - Pressure Increase maxiGRIP™

Phase Change - Pressure Increase maxiGRIP™

Advanced Thermal Solutions Inc

The need to consider interfacial resistance is very important. This tutorial will discuss the thermal interface material (TIMs) performance and usage.

maxiGrip,maxiFlow

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM663 - Immediate$288.70View Details
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM296 - Immediate$340.78View Details
HEAT SINK 27MM X 27MM X 9.5MMATS-51270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM202 - Immediate$312.87View Details
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766663 - Immediate$234.34View Details
HEAT SINK 19MM X 19MM X 19.5MMATS-51190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM2609 - Immediate$293.29View Details
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM182 - Immediate$298.08View Details
HEATSINK 35X35X14.5MM W/OUT TIMATS-51350K-C0-R0HEATSINK 35X35X14.5MM W/OUT TIM141 - Immediate$298.08View Details
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - Immediate$323.07View Details
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM690 - Immediate$323.49View Details
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM216 - Immediate$328.49View Details
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Publish Date: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Publish Date: 2012-10-15

Related Product Highlight

Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Heat Sink Attachment The maxiGRIP system heat sink attachment conforms to standards including Telcordia GR-63-Core, MIL-STD-810, and RoHS compliance.