TDK InvenSense

ICM-20948 9-Axis Motion-Tracking Device

InvenSense features their ICM-20948 high-performance 9-axis (sensor fusion-on-chip with a Digital Motion Processor™ (DMP™)

Image of InvenSense ICM-20948 9-Axis Motion-Tracking Device InvenSense's ICM-20948 9-axis motion-tracking device is ideal for applications looking for 9-axis sensor fusion. ICM-20948 comes with a digital motion processor that can be utilized to offload the 9-axis sensor fusion from the micro controller thus reducing power. It supports an auxiliary I²C interface to external sensors, on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features an operating voltage range down to 1.71 V. Communication ports include I2C and high speed SPI at 7 MHz.

Features
  • Operating voltage: 1.71 V to 3.6 V
  • Gyro sensitivity error: ±1.5%
  • Gyro noise: ±0.011 dps/√Hz
  • Accel noise: 190 µg/√Hz
  • Mag FSR: 4900 µT
  • Mag sensitivity: 0.15 µT/LSB
  • Backside I2C bus available for external sensor connection
  • 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, and a DMP in a 3 mm x 3 mm x 0.9 mm (24-pin QFN) package
  • DMP offloads computation of motion processing algorithms from the host processor, improving system power performance
Applications
  • IoT
  • VR
  • Drones
  • Gaming

ICM-20948 9-Axis Motion Tracking Device

ImageManufacturer Part NumberDescriptionOutput TypeOperating TemperatureAvailable QuantityPriceView Details
IMU ACCEL/GYRO/COMPI2C/SPI 24QFNICM-20948IMU ACCEL/GYRO/COMPI2C/SPI 24QFNI2C, SPI-40°C ~ 85°C25103 - Immediate$141.06View Details
Published: 2017-04-13

Related Articles and Blogs

How to Use Sensor Fusion to Improve Industry 4.0 Production Processes and Logistics Sensor fusion combines data from multiple sensors to provide a more detailed and nuanced understanding of system operation or the environment.
Take a Simpler Route to Low-Power, 9-Axis Motion Tracking Designers can add low-power, 9-axis motion sensing to their MCU-based designs with minimal effort using a 3mm x 3mm TDK InvenSense module.