Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA33002-21P/CU/3.4Y

DigiKey Part Number
4573-MBA33002-21P/CU/3.4Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA33002-21P/CU/3.4Y
Description
CU HEAT SINK 33X33X21MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.299" (33.00mm)
Width
1.299" (33.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
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In-Stock: 38
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Quantity
All prices are in CZK
Tray
QuantityUnit PriceExt Price
1119,06000 Kč119,06 Kč
10105,28400 Kč1 052,84 Kč
25100,29480 Kč2 507,37 Kč
5096,67060 Kč4 833,53 Kč
10093,17650 Kč9 317,65 Kč
25088,74428 Kč22 186,07 Kč
50085,52822 Kč42 764,11 Kč
1 00082,42576 Kč82 425,76 Kč
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:119,06000 Kč
Unit Price with VAT:144,06260 Kč
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