Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
APF30-30-06CB
APF30-30-06CB

APF30-30-06CB

DigiKey Part Number
294-1151-ND
Manufacturer
Manufacturer Product Number
APF30-30-06CB
Description
HEATSINK LOW-PROFILE FORGED
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Fins
Length
1.181" (30.00mm)
Width
1.181" (30.00mm)
Diameter
-
Fin Height
0.250" (6.35mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.40°C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Material Finish
Black Anodized
Base Product Number
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 153
Check for Additional Incoming Stock
All prices are in CZK
Box
QuantityUnit PriceExt Price
1140,69000 Kč140,69 Kč
10124,45500 Kč1 244,55 Kč
25118,53800 Kč2 963,45 Kč
50114,25440 Kč5 712,72 Kč
100110,12400 Kč11 012,40 Kč
300103,87150 Kč31 161,45 Kč
600100,10552 Kč60 063,31 Kč
1 20096,47181 Kč115 766,17 Kč
Manufacturers Standard Package
Unit Price without VAT:140,69000 Kč
Unit Price with VAT:170,23490 Kč