Lead Free Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g)
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WS991LT500T4

DigiKey Part Number
315-WS991LT500T4-ND
Manufacturer
Manufacturer Product Number
WS991LT500T4
Description
SOLDER PASTE THERMALLY STABLE WS
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
Water Soluble
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Base Product Number
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All prices are in CZK
Bulk
QuantityUnit PriceExt Price
12 260,98000 Kč2 260,98 Kč
51 948,17800 Kč9 740,89 Kč
101 826,82400 Kč18 268,24 Kč
251 677,50800 Kč41 937,70 Kč
501 572,35500 Kč78 617,75 Kč
1001 473,43470 Kč147 343,47 Kč
Manufacturers Standard Package
Unit Price without VAT:2 260,98000 Kč
Unit Price with VAT:2 735,78580 Kč